Press Releases

PMJ 2017: D2S Releases Fifth-Generation GPU Acceleration Platform for Semiconductor Manufacturing
Apr. 4, 2017

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BACUS 2016: D2S Releases Fourth-Generation GPU Acceleration Platform for Semiconductor Manufacturing
Sep. 12, 2016

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BACUS 2015: Advantest and D2S Partner to Tackle CD Uniformity Errors with GPU-Accelerated Wafer Plane Analysis for Advanced Photomasks
Sep. 29, 2015

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Yoshio Tanaka Joins D2S, Inc. as Vice President to Drive New Business Development in Japan
Sep. 8, 2014

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D2S Expands GPGPU Acceleration Capability for Advanced Semiconductor Lithography and Photomask Manufacturing with Acquisition of Gauda
Jun. 3, 2014

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Lithography Luminary Dr. Leo Pang Joins D2S as Chief Product Officer
May. 12, 2014

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D2S and NuFlare Extend Partnership to Accelerate eBeam Computational Design Platform Deployment for Advanced Photomasks
Sep. 9, 2013

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D2S Unveils eBeam Solution that Both Reduces Photomask Write Time and Improves Photomask Accuracy at 20‐nm Node and Beyond
Sep. 11, 2012

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Ecosystem Quote Sheet for TrueMask® MDP — the First and Only Model‐Based Mask Data Preparation Solution to Process Full‐Chip Design Data for Production Applications
Sep. 11, 2012

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D2S Expands Management Team with Photomask and Semiconductor Industry Veterans – New Hires from Intel, KLA-Tencor and Synopsys Bring Wealth of Semiconductor Experience as D2S Enters Next Stage of Growth
Feb. 13, 2012

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eBeam Initiative Roadmap to Focus on Semiconductor Photomask Critical Dimension Uniformity at SPIE Advanced Lithography 2012 Symposium – Proof Points at SPIE demonstrate the ability of eBeam Technologies to Improve 20-nm and 14-nm Wafer Yields
Feb. 13, 2012

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DFeB Technology Leader D2S Appoints New President of Japanese Subsidiary
Oct. 1, 2011

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D2S Unveils Industry's First Mask-Wafer Double Simulation Platform - TrueMask® DS enables interactive optimization of mask write-times and wafer quality
Sep. 20, 2011

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D2S Taps Industry Semiconductor EDA Veteran to Serve as Vice President of Engineering
Mar. 29, 2011

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Fellow eBeam Initiative Members D2S and NuFlare Partner to Reduce Write Times for Complex 22-nm Photomask – D2S Option to NuFlare EBM-700 System Enalbes Design for E-Beam (DFEB) Mask Technology
Mar. 1, 2011

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eBeam Initiative Members Present Collaborative Results at SPIE Advanced Lithography Symposium 2011 – E-beam Advancements Featured for both Complex Photomasks and Maskless Lithography; New Members Added to eBeam Initiative
Feb. 22, 2011

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eBeam Initiative Members Jointly Present Collaborative Results at SPIE/BACUS Symposium 2010 – Four New Companies Join eBeam Initiative
Sep. 7, 2010

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D2S CEO AKI FUJIMURA TO PARTICIPATE IN 22‐NM MANUFACTURING PANEL AT DAC 2010
May. 25, 2010

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eBeam Initiative Members Publish Collaborative Results at Photomask Japan 2010 – Three New Companies Join eBeam Initiative
Apr. 13, 2010

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D2S and JEOL Partner to Reduce Write Times for Advanced Photomask Production
Apr. 13, 2010

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D2S Redefines Mask Rules for the 22-nm and Smaller Technology Nodes
Feb. 23, 2010

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eBeam Initiative Membership Grows to 27 - Initiative Introduces DFEB Mask Roadmap for High Volume Integrated Circuits
Feb. 23, 2010

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eBeam Initiative Introduces Design for E-Beam Methodology Guidelines and Training Courses
Nov. 9, 2009

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D2S to Speak at the International Conference on Computer-Aided Design
Oct. 12, 2009

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eBeam Initiative Members Collaborate to Enhance Design for E-Beam Throughput:
Oct. 1, 2009

D2S' DFEB Packed Stencil Technology and Advantest Corporation’s Direct Write Lithography Equipment Increase DFEB Character Set by More Than 4X, October 1, 2009

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Silicon Results Validate Design for e-Beam Methodology at the 65-nm node
May. 26, 2009

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Kazuyuki Kawauchi, former CEO of Fujitsu Microelectronics America, Appointed President of D2S KK
Apr. 21, 2009

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D2S Secures $9 Million In Series B Financing
Apr. 1, 2009

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eBeam Initiative Members to Present at Magma User Conference
Mar. 26, 2009

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20 Electronic Industry Leaders Collaborate to Accelerate Development and Adoption of Design for E-Beam Technology
Feb. 24, 2009

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Vistec, CEA/Leti and D2S Join Forces on E-Beam Direct Write Solutions for the 45- and 32-nm Nodes
Jan. 12, 2009

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Fujitsu Microelectronics, e-Shuttle and D2S to Develop Maskless ICs.
Oct. 8, 2008

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