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Semiconductor Engineering: Why Curvy Design Now? Manufacturing Is Possible And Scaling Needs It

News • September 21, 2023

Wire length reduction techniques such as curvy target shapes are needed to reduce congestion.
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Semiconductor Engineering: High-NA Lithography Starting To Take Shape

News • July 25, 2023

Includes coverage of the "Why Curvy Design is an Opportunity Now" panel moderated by D2S CEO Aki Fujimura at DAC 2023
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DAC 2023: Why is Curvy Design an Opportunity Now? Panel Slides

News • July 14, 2023

D2S, Inc. CEO Aki Fujimura moderated a panel to discuss the opportunities for curvy design presented by new curvy manufacturing capabilities. Panelists included: John Kibarian, PDF Solutions; Ezequiel Russell, Micron Technologies; Andrew Kahng, UC San Diego; Steve Teig, Perceive. Slides as presented on July 11, 2023.
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EETimes: DAC 2023, Day 2: Digital Twins, Chiplets and Curvy Design

News • July 12, 2023

Sally Ward-Foxton, Sr. Reporter at EETimes sites the "Why Curvy Design is an Opportunity Now" panel moderated by D2S CEO Aki Fujimura as her favorite event of the day. Her summary of the panel starts at 8:11 in the video.
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Semiconductor Engineering: DAC/Semicon West Addresses Top Issues, Trends For Chips

News • July 12, 2023

DAC 2023 roundup article includes coverage of the "Why Curvy Design is an Opportunity Now" panel moderated by D2S CEO Aki Fujimura.
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July 11, 2023: DAC Panel Discussion: Why is Curvy Design an Opportunity Now?

News • June 24, 2023

Join D2S, Inc. CEO Aki Fujimura as he moderates a panel to discuss the opportunities for curvy design presented by new curvy manufacturing capabilities. Panelists include: Steve Teig, Perceive; Ezequiel Russell, Micron Technologies; John Kibarian, PDF Solutions; Andrew Kahng, UC San Diego. Tuesday, July 11, 2023, 1:30pm-3:00pm PDT, Room 3014, 3rd Floor.
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