News | D2S

Silicon Semiconductor: Why the World is Moving to Curvilinear

News • August 30, 2024

Part 1 of a two part article by Leo Pang of D2S

Semiconductor Engineering: Key Technologies To Extend EUV To 14 Angstroms

News • July 29, 2024

D2S CEO Aki Fjuimura comments on curvilinear masks for advanced EUV as part of this overview of what's needed to extend EUV.

Semiconductor Engineering: European Mask And Lithography Conference 2024 Worth Attending

News • July 23, 2024

D2S/eBeam Initiative’s Asmus Hetzel talks about key trends at EMLC, including curvilinear design, AI in inspection, and multi-beam mask writers

Semiconductor Engineering: Single Vs. Multi-Patterning Advancements For EUV

News • June 20, 2024

EUV patterning has come a long way in the past five years, but old challenges resurface with high-NA EUV. Dr. Leo Pang of D2S adds his perspective on advanced lithography and curvilinear masks for EUV.

Semiconductor Engineering: Opportunities Grow For GPU Acceleration

News • June 5, 2024

Experts at the Table: Semiconductor Engineering sat down to discuss the impact of GPU acceleration on mask design and production and other process technologies, with Aki Fujimura, CEO of D2S; Youping Zhang, head of ASML Brion; Yalin Xiong, senior vice president and general manager of the BBP and reticle products division at KLA; and Kostas Adam, vice president of engineering at Synopsys.

Semiconductor Engineering: Navigating The GPU Revolution

News • April 24, 2024

Potential cost and time benefits are driving GPU adoption, despite challenges. Experts at the table discussion includes D2S CEO Aki Fujimura; Youping Zhang, head of ASML Brion; Yalin Xiong, senior vice president and general manager of the BBP and reticle products division at KLA; and Kostas Adam, vice president of engineering at Synopsys.