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D2S CEO AKI FUJIMURA TO PARTICIPATE IN 22‐NM MANUFACTURING PANEL AT DAC 2010

Press Release • March 25, 2010

Panel of Experts to Discuss Design and Lithography Challenges for 22‐nm Manufacturing
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eBeam Initiative Membership Grows to 27 - Initiative Introduces DFEB Mask Roadmap for High Volume Integrated Circuits

Press Release • February 23, 2010

Initiative Introduces Design For E‐Beam Mask Roadmap for High‐Volume Integrated Circuits
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D2S Redefines Mask Rules for the 22-nm and Smaller Technology Nodes

Press Release • February 23, 2010

Design for eBeam (DFEB) Mask Technology Makes Advanced Photomask Production Practical
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eBeam Initiative Introduces Design for eBeam Methodology Guidelines and Training Courses

Press Release • November 9, 2009

Guidelines and Training Build on Milestones Achieved During 2009   
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D2S to Speak at the International Conference on Computer-Aided Design

Press Release • October 12, 2009

Tutorial to Further Educate Design Community on the Future of E‐beam Direct Write Technologies
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eBeam Initiative Members Collaborate to Enhance Design for eBeam Throughput:

Press Release • October 1, 2009

D2S' DFEB Packed Stencil Technology and Advantest Corporation’s Direct Write Lithography Equipment Increase DFEB Character Set by More Than 4X, October 1, 2009
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