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Uniformity
The critical success factor
Mask Uniformity
Path to wafer uniformity
Wafer Uniformity
Achieving the best process window
GPU Acceleration
Practical full-reticle processing
Curvilinear
Better mask and wafer quality
Pixel Domain
Shape-agnostic computing
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PLDC
MPC for uniformity and linearity
TrueMask
®
ILT
Full-chip, Entirely Manufacturable™ ILT
TrueModel
®
Physical model for masks and wafers
CDP
GPU-accelerated design platform
About D
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About D
2
S
Timeline of D
2
S Technology Highlights
Technologies
Uniformity
The critical success factor
Mask Uniformity
Path to wafer uniformity
Wafer Uniformity
Achieving the best process window
GPU Acceleration
Practical full-reticle processing
Curvilinear
Better mask and wafer quality
Pixel Domain
Shape-agnostic computing
Products
PLDC
MPC for uniformity and linearity
TrueMask
®
ILT
Full-chip, Entirely Manufacturable™ ILT
TrueModel
®
Physical model for masks and wafers
CDP
GPU-accelerated design platform
About D
2
S
About D
2
S
Timeline of D
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Page 36
Kazuyuki Kawauchi, former CEO of Fujitsu Microelectronics America, Appointed President of D
2
S KK
Press Release • April 21, 2009
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D
2
S Secures $9 Million In Series B Financing
Press Release • April 1, 2009
Global Investors to Back Market Development Phase Of D
2
S’ Breakthrough Design for eBeam Technology
Read More
eBeam Initiative Members to Present at Magma User Conference
Press Release • March 26, 2009
D
2
S and Fastrack Design Educate Users on Design For eBeam
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20 Electronic Industry Leaders Collaborate to Accelerate Development and Adoption of Design for eBeam Technology
Press Release • February 24, 2009
eBeam Initiative Aims to Increase Design Starts and Reduce Time-to-market in Semiconductor Industry
English
中文 (繁體)
中文 (简体)
日本語
Vistec, CEA/Leti and D
2
S Join Forces on eBeam Direct Write Solutions for the 45- and 32-nm Nodes
Press Release • January 12, 2009
VISTEC, CEA/LETI AND D
2
S JOIN FORCES ON eBeam DIRECT WRITE SOLUTIONS FOR THE 45- AND 32-NM NODES
English
日本語
Fujitsu Microelectronics, e-Shuttle and D
2
S to Develop Maskless ICs.
Press Release • October 8, 2008
Industry leaders introduce design for eBeam technology to deliver significant cost and time reductions for producing prototypes, derivatives and high-value ICs
English
日本語
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