Micron and D2S presented a joint paper at SPIE Photomask Technology 2019 (Best Paper, Oral Presentation — 2nd Place) that confirmed that TrueMask® ILT produces a much larger process window than OPC, and demonstrated the high quality of TrueMask® ILT mask results in terms of continuity and symmetry.
Linyong Pang, Ezequiel Vidal Russell, Bill Baggenstoss, Michael Lee, Jennefir Digaum, Ming-Chuan Yang, P. Jeffrey Ungar, Ali Bouaricha; Kechang Wang, Bo Su, Ryan Pearman, Aki Fujimura, “Study of mask and wafer co-design that utilizes a new extreme SIMD approach to computing in memory manufacturing: full-chip curvilinear ILT in a day,” Proc. SPIE 11148, Photomask Technology 2019 (October 3, 2019). DOI: https://doi.org/10.1117/12.2534629
In August, 2021, SPIE published Leo Pang’s review of 30 years of ILT development, “Inverse lithography technology: 30 years from concept to practical, full-chip reality,” SPIE 2021, DOI: 10.1117/1.JMM.20.3.030901