News | D2S

Asianometry: TSMC's Incredible 2nm Curvy Masks

News • November 2, 2025

This video provides an overview of progress on curvy masks, including the D2S ILT solution (TrueMask® ILT).

36Kr: European Central Station: Dialogue with Dr. PANG Linyong, an expert in semiconductor lithography

News • October 31, 2025

Full-chip ILT is a key technology for the downward iteration of semiconductors. A conversation with Leo Pang of D2S.

Expert Panel Sees History Of Continuous Photomask Innovations As Key To The Future

News • October 27, 2025

The state of photomask revenues, EUV pellicles, and curvilinear masks. Panel included Jim Wiley, Wiley Strategic Solutions, Chan-UK (CU) Jeon, CTO of Tekscend Photomask, and Harry Levinson, HJL Lithography, and was moderated by Aki Fujimura, CEO of D2S.

Leo Pang from D2S to deliver keynote at SPIE International Workshop for Advanced Patterning Solutions (IWAPS) on October 14, 2025

News • September 18, 2025

"The Most Effective Way to Advance Technology Nodes -- Even Mature Ones: Production-Ready, Full-Chip, Curvilinear ILT and Curvilinear Masks for DUV"

Semiconductor Digest: PLDC: A Robust MPC Solution for any Mask Shape with Zero Impact on Turnaround Time

News • September 6, 2025

Paris Spinelli from Micron Technologies details their experience with the D2S PLDC solution.

EE Times: U.S. Startups Debut First eBeam Tools for Wafer Writing

News • August 11, 2025

D2S CEO, Aki Fujimura, is quoted in this article covering new companies producing eBeam tools for wafer writing.