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EE Journal: Full-Chip ILT in a Day

News • December 3, 2019

D2S Brings a Custom Computing Platform to the Party
Experts at the Table: AI, EUV pellicles and inverse lithography are hot topics in mask making today
How to speed up manufacturing with inverse lithography technology with complex curvilinear data, with Leo Pang of D2S
Ryan Pearman, Jeff Ungar, Nagesh Shirali, Abishek Shendre, Mariusz Niewczas, Leo Pang, Aki Fujimura, “Adopting curvilinear shapes for production ILT: challenges and opportunities,” Proc. SPIE 11148, Photomask Technology 2019 (October 10, 2019). DOI: https://doi.org/10.1117/12.2538445
Linyong Pang, Ezequiel Vidal Russell, Bill Baggenstoss, Michael Lee, Jennefir Digaum, Ming-Chuan Yang, P. Jeffrey Ungar, Ali Bouaricha; Kechang Wang, Bo Su, Ryan Pearman, Aki Fujimura, “Study of mask and wafer co-design that utilizes a new extreme SIMD approach to computing in memory manufacturing: full-chip curvilinear ILT in a day,” Proc. SPIE 11148, Photomask Technology 2019 (October 3, 2019). DOI: https://doi.org/10.1117/12.2534629
Linyong Pang, Suhas Pillai, Thang Nguyen, Mike Meyer, Ajay Baranwal, Henry Yu, Mariusz Niewczas, Ryan Pearman, Abhishek Shendre, Aki Fujimura, “Making digital twins using the Deep Learning Kit (DLK),” Proc. SPIE 11148, Photomask Technology 2019 (October 21, 2019). DOI: https://doi.org/10.1117/12.2538508