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D2S, e-Shuttle and Fujitsu Microelectronics Collaborate On First Test Chip

D2S Secures $9 Million In Series B Financing

Press Release • April 1, 2009

Global Investors to Back Market Development Phase Of D2S’ Breakthrough Design for eBeam Technology
D2S and Fastrack Design Educate Users on Design For eBeam
eBeam Initiative Aims to Increase Design Starts and Reduce Time-to-market in Semiconductor Industry
VISTEC, CEA/LETI AND D2S JOIN FORCES ON eBeam DIRECT WRITE SOLUTIONS FOR THE 45- AND 32-NM NODES