News

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D2S Unveils eBeam Solution that Both Reduces Photomask Write Time and Improves Photomask Accuracy at 20‐nm Node and Beyond

Press Release • September 11, 2012

TrueMask® MDP is the First and Only Model‐Based Mask Data Preparation Solution to Process Full‐Chip Design Data for Production Applications

eBeam Initiative Roadmap to Focus on Semiconductor Photomask Critical Dimension Uniformity at SPIE Advanced Lithography 2012 Symposium – Proof Points at SPIE demonstrate the ability of eBeam Technologies to Improve 20-nm and 14-nm Wafer Yields

Press Release • February 13, 2012

Proof points at SPIE Advanced Lithography demonstrate the ability of eBeam technologies to improve 20‐nm and 14‐nm wafer yields

D2S Expands Management Team with Photomask and Semiconductor Industry Veterans – New Hires from Intel, KLA-Tencor and Synopsys Bring Wealth of Semiconductor Experience as D2S Enters Next Stage of Growth

Press Release • February 13, 2012

New Hires from Intel, KLA‐Tencor and Synopsys Bring Wealth of Semiconductor Experience as D2S Enters Next Stage of Growth

DFeB Technology Leader D2S Appoints New President of Japanese Subsidiary

Press Release • October 1, 2011

D2S Unveils Industry's First Mask-Wafer Double Simulation Platform

Press Release • September 20, 2011

TrueMask® DS enables interactive optimization of mask write‐times and wafer quality

D2S Taps Industry Semiconductor EDA Veteran to Serve as Vice President of Engineering

Press Release • March 29, 2011

D2S Fills Critical Role as Momentum Builds to Support Cost‐Effective 20‐nm Optical Lithography