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Uniformity
The critical success factor
Mask Uniformity
Path to wafer uniformity
Wafer Uniformity
Achieving the best process window
GPU Acceleration
Practical full-reticle processing
Curvilinear
Better mask and wafer quality
Pixel Domain
Shape-agnostic computing
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PLDC
MPC for uniformity and linearity
TrueMask
®
ILT
Full-chip, Entirely Manufacturable™ ILT
TrueModel
®
Physical model for masks and wafers
CDP
GPU-accelerated design platform
About D
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About D
2
S
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2
S Technology Highlights
Technologies
Uniformity
The critical success factor
Mask Uniformity
Path to wafer uniformity
Wafer Uniformity
Achieving the best process window
GPU Acceleration
Practical full-reticle processing
Curvilinear
Better mask and wafer quality
Pixel Domain
Shape-agnostic computing
Products
PLDC
MPC for uniformity and linearity
TrueMask
®
ILT
Full-chip, Entirely Manufacturable™ ILT
TrueModel
®
Physical model for masks and wafers
CDP
GPU-accelerated design platform
About D
2
S
About D
2
S
Timeline of D
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Page 6
Semiconductor Engineering: Luminary Panel Sees Progress In EUV Pellicle Adoption As Critical For EUV
News • November 21, 2024
Factors that impact mask lifetime, the future role of actinic inspection, and minimum mask dimensions for high-NA EUV.
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Semiconductor Engineering: Luminary Panel Sees Multi-Beam Mask Writers And Curvilinear Masks Key To 193i And EUV
News • October 24, 2024
Purchases of new photomask equipment are expected to grow over the next three years.
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Semiconductor Industry Luminary Bala Thumma Joins D
2
S as Vice President
Press Release • September 10, 2024
Bala Thumma will be responsible for D
2
S’ GPU-accelerated pixel-level dose correction (PLDC) technology, which enhances pattern fidelity and accuracy for writing all masks including curvilinear.
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Silicon Semiconductor: Why the World is Moving to Curvilinear
News • August 30, 2024
Part 1 of a two part article by Leo Pang of D
2
S
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Semiconductor Engineering: Key Technologies To Extend EUV To 14 Angstroms
News • July 29, 2024
D
2
S CEO Aki Fjuimura comments on curvilinear masks for advanced EUV as part of this overview of what's needed to extend EUV.
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Semiconductor Engineering: European Mask And Lithography Conference 2024 Worth Attending
News • July 23, 2024
D
2
S/eBeam Initiative’s Asmus Hetzel talks about key trends at EMLC, including curvilinear design, AI in inspection, and multi-beam mask writers
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