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Technologies
Uniformity
The critical success factor
Mask Uniformity
Path to wafer uniformity
Wafer Uniformity
Achieving the best process window
GPU Acceleration
Practical full-reticle processing
Curvilinear
Better mask and wafer quality
Pixel Domain
Shape-agnostic computing
Products
PLDC
MPC for uniformity and linearity
TrueMask
®
ILT
Full-chip, Entirely Manufacturable™ ILT
TrueModel
®
Physical model for masks and wafers
CDP
GPU-accelerated design platform
About D
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About D
2
S
Timeline of D
2
S Technology Highlights
Technologies
Uniformity
The critical success factor
Mask Uniformity
Path to wafer uniformity
Wafer Uniformity
Achieving the best process window
GPU Acceleration
Practical full-reticle processing
Curvilinear
Better mask and wafer quality
Pixel Domain
Shape-agnostic computing
Products
PLDC
MPC for uniformity and linearity
TrueMask
®
ILT
Full-chip, Entirely Manufacturable™ ILT
TrueModel
®
Physical model for masks and wafers
CDP
GPU-accelerated design platform
About D
2
S
About D
2
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Timeline of D
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Page 8
Monday, October 19, 2020
Leo Pang presents the results of a joint paper with Micron Technology on how to enable faster VSB writing of 193i curvilinear ILT masks
English
Monday, October 19, 2020
Aki Fujimura highlights results of the sixth annual eBeam Initiative Mask Makers survey
English
Monday, October 19, 2020
Leo Pang, chief product officer of D
2
S, offers his impressions of the SPIE Photomask Technology + EUV Lithography Conference in Chinese
中文
Tuesday, September 22, 2020
Aki Fujimura, CEO of D
2
S, moderates the eBeam Initiative panel on mask survey results at SPIE Photomask Technology Conference 2020
English
Tuesday, June 2, 2020
Leo Pang, Chief Product Officer of D
2
S, reviews a unique GPU-accelerated approach to curvilinear inverse lithography technology (ILT) and introduces mask-wafer co-optimization (MWCO).
English
Tuesday, March 17, 2020
Aki Fujimura of D
2
S with SPIE AL 2020 highlights, including EUV, Deep Learning, curvilinear masks
English
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