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Technologies
Uniformity
The critical success factor
Mask Uniformity
Path to wafer uniformity
Wafer Uniformity
Achieving the best process window
GPU Acceleration
Practical full-reticle processing
Curvilinear
Better mask and wafer quality
Pixel Domain
Shape-agnostic computing
Products
PLDC
MPC for uniformity and linearity
TrueMask
®
ILT
Full-chip, Entirely Manufacturable™ ILT
TrueModel
®
Physical model for masks and wafers
CDP
GPU-accelerated design platform
About D
2
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About D
2
S
Timeline of D
2
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Technologies
Uniformity
The critical success factor
Mask Uniformity
Path to wafer uniformity
Wafer Uniformity
Achieving the best process window
GPU Acceleration
Practical full-reticle processing
Curvilinear
Better mask and wafer quality
Pixel Domain
Shape-agnostic computing
Products
PLDC
MPC for uniformity and linearity
TrueMask
®
ILT
Full-chip, Entirely Manufacturable™ ILT
TrueModel
®
Physical model for masks and wafers
CDP
GPU-accelerated design platform
About D
2
S
About D
2
S
Timeline of D
2
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Page 7
Tuesday, June 22, 2021
Leo Pang of D
2
S recaps in Chinese a joint paper with Micron Technology on enabling faster VSB writing of 193i curvilinear ILT masks. Also in English.
English
中文
Tuesday, June 22, 2021
Aki Fujimura of D
2
S interviews Vivek Singh about his new role as VP, Advanced Technology Group at NVIDIA
English
Monday, March 22, 2021
Aki Fujimura of D
2
S interviews Harry Levinson of HJL Lithography on his takeaways from the SPIE 2021 Advanced Lithography Conference. Leo Pang of D
2
S offers his perspective in Chinese.
English
中文
Wednesday, March 10, 2021
Semiconductor Engineering: Changing The Rules For Chip Scaling
English
Thursday, February 25, 2021
Aki Fujimura, CEO of D
2
S, moderates the eBeam Initiative panel on curvilinear shapes at SPIE-AL 2021
English
Thursday, November 19, 2020
Aki Fujimura, CEO of D
2
S, talks about joining the ESD Alliance
English
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