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Mike Schuh Joins D2S Board of Directors

News • April 28, 2020

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Semiconductor Engineering: What’s Next With AI In Fabs?

News • April 23, 2020

Experts at the Table, Part 3: Where machine/deep learning is useful and where it’s not.
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SPIE Advanced Lithography 2020: TrueMask® ILT MWCO: Full-chip curvilinear ILT in a day and full mask multi-beam and VSB writing in 12 hrs for 193i

Publication • April 3, 2020

Linyong (Leo) Pang, P. Jeffrey Ungar, Ali Bouaricha , Lu Sha, Michael Pomerantsev, Mariusz Niewczas, Kechang Wang, Bo Su, Ryan Pearman, and Aki Fujimura, "TrueMask® ILT MWCO: Full-chip curvilinear ILT in a day and full mask multi-beam and VSB writing in 12 hrs for 193i," Proc. SPIE 11327, Optical Microlithography XXXIII, 113270K (Presented at SPIE Advanced Lithography: February 26, 2020; Published: 31 March 2020); https://doi.org/10.1117/12.2554867.
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Semiconductor Engineering: How And Where ML Is Being Used In IC Manufacturing

News • April 1, 2020

Experts at the Table, Part 2: ML is playing a bigger role in metrology and lithography, but it can’t replace physics-based models.
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Semiconductor Engineering: What Machine Learning Can Do In Fabs

News • March 25, 2020

Experts at the Table: It’s not as accurate as simulation, but it’s a lot faster.
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TrueMask® ILT MWCO: Full-Chip Curvilinear ILT in a Day & Full Mask Multi-Beam and VSB Writing in 12 hours for 193i

Publication • March 4, 2020

Presented at SPIE Advanced Lithography Conference by Leo Pang of D2S
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