News

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TrueMask® ILT MWCO: Full-Chip Curvilinear ILT in a Day & Full Mask Multi-Beam and VSB Writing in 12 hours for 193i

Publication • March 4, 2020

Presented at SPIE Advanced Lithography Conference by Leo Pang of D2S

D2S Extends GPU-Accelerated Wafer-Plane Analysis to EUV Photomasks

Press Release • February 25, 2020

D2S TrueMask® WPA enables fast and accurate simulation of complex and curvilinear mask shapes for cost-effective CD metrology

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EE Journal: Full-Chip ILT in a Day

News • December 3, 2019

D2S Brings a Custom Computing Platform to the Party

Semiconductor Engineering: Making And Protecting Advanced Masks

News • November 28, 2019

Experts at the Table: AI, EUV pellicles and inverse lithography are hot topics in mask making today

Semiconductor Engineering: Using Digital Twins And DL In Lithography

News • November 22, 2019

How to speed up manufacturing with inverse lithography technology with complex curvilinear data, with Leo Pang of D2S

SPIE Photomask Technology 2019: Adopting Curvilinear Shapes for Production ILT: Challenges and Opportunities

Publication • November 15, 2019

Ryan Pearman, Jeff Ungar, Nagesh Shirali, Abishek Shendre, Mariusz Niewczas, Leo Pang, Aki Fujimura, “Adopting curvilinear shapes for production ILT: challenges and opportunities,” Proc. SPIE 11148, Photomask Technology 2019 (October 10, 2019). DOI: https://doi.org/10.1117/12.2538445