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Uniformity
The critical success factor
Mask Uniformity
Path to wafer uniformity
Wafer Uniformity
Achieving the best process window
GPU Acceleration
Practical full-reticle processing
Curvilinear
Better mask and wafer quality
Pixel Domain
Shape-agnostic computing
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PLDC
MPC for uniformity and linearity
TrueMask
®
ILT
Full-chip, Entirely Manufacturable™ ILT
TrueModel
®
Physical model for masks and wafers
CDP
GPU-accelerated design platform
About D
2
S
About D
2
S
Timeline of D
2
S Technology Highlights
Technologies
Uniformity
The critical success factor
Mask Uniformity
Path to wafer uniformity
Wafer Uniformity
Achieving the best process window
GPU Acceleration
Practical full-reticle processing
Curvilinear
Better mask and wafer quality
Pixel Domain
Shape-agnostic computing
Products
PLDC
MPC for uniformity and linearity
TrueMask
®
ILT
Full-chip, Entirely Manufacturable™ ILT
TrueModel
®
Physical model for masks and wafers
CDP
GPU-accelerated design platform
About D
2
S
About D
2
S
Timeline of D
2
S Technology Highlights
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Page 29
D
2
S Recognized by CIOReview
News • July 22, 2018
We’re honored to be named as one of the 20 most promising HPC solution providers for 2018.
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Semiconductor Engineering: Fab Meets Machine Learning
News • July 19, 2018
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New GPU-Accelerated Supercomputers Change the Balance of Power on the TOP500
News • July 2, 2018
D
2
S is in good company with its GPU-Acceleration strategy
Read More
DL, EUV Masks & more: Summer 2018 Video Journal Released
Publication • June 12, 2018
Aki Fujimura interviews Steve Teig, Xperi CTO, about Deep Learning; plus D
2
S news
English
中文
日本語
New Videos Released by the eBeam Initiative
News • March 22, 2018
Aki Fujimura and Leo Pang share D
2
S updates in this video journal
English
中文
日本語
Solid State Technology: Big changes in mask manufacturing and what it means for mask models
News • February 17, 2018
Ryan Pearman explains a single mask model approach in the EUV era
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